ZHAO Shijie; MA Haonan; LIU Xia

doi:10.7498/aps.74.20241590

Abstract

With the continuous development of micro-scale exploration, micro/nano fabrication technologies, represented by photolithography and various etching processes, have been widely used for fabricating micro- and nanoscale structures and devices. These developments have driven innovation in fields such as integrated circuits, micro-nano optoelectronic devices, and micro-electromechanical systems, while also bringing new opportunities to fundamental scientific research, including the study of microscopic property regulation mechanisms. In recent years, as an emerging micro-nano fabrication technology, thermal scanning probe lithography (t-SPL) has shown promise and unique advantages in applications related to the fabrication and property regulation of two-dimensional materials, as well as the creation of nanoscale grayscale structures. By employing the fabrication methods such as material removal and modification, t-SPL can be used as an advanced technology for regulating two-dimensional material properties, or directly effectively regulating various properties of two-dimensional materials, thereby significantly improving the performance of two-dimensional material devices, or advancing fundamental scientific research on the micro/nano scale. This paper starts with the principles and characteristics of t-SPL, analyzes the recent research progress of the micro-nano fabrication and property modulation of two-dimensional materials, including several researches achieved by using t-SPL as the core fabrication methods, such as direct patterning, strain engineering, and reaction kinetics research of two-dimensional materials. Finally, the challenges in t-SPL technology are summarized, the corresponding possible solutions are proposed, and the promising applications of this technology are explored.

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Corresponding author: LIU Xia, xia.liu@bit.edu.cn

Funds: Project supported by the National Key Research and Development Program of China (Grant No. 2023YFB3405600) and the National Natural Science Foundation of China (Grant No. 62274013).

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t-SPL工艺类型	参考文献	领域	应用
减材	[1]	微纳加工	激光加热探针的早期纳米压痕研究
减材	[2]	微纳加工	IBM千足虫计划, t-SPL工艺雏形
减材	[4]	微纳加工	高速刻写工艺, t-SPL刻写速度优化
减材	[9]	微纳加工	使用t-SPL直接对二维材料进行图案化
减材	[13]	微纳加工	t-SPL制造灰度结构并转移至硅衬底
减材	[14]	应变工程	利用灰度结构衬底实现二维材料应变工程, 提升器件性能
减材	[19]	纳米光学与光子学	基于 hBN 的高分辨率灰度光学微结构
减材	[20]	量子点调控	纳米孔量子点定位, 亚纳米量子位设计
减材	[22]	微纳加工	大面积热敏抗蚀剂的快速图案化
改性	[15]	表面化学与电子学	氧化石墨烯还原反应, 生成导电图案
改性	[16]	表面化学	氧化石墨烯的导电纳米线制造
改性	[17]	反应动力学	热化学反应研究, 摩擦系数调控
改性	[18]	缺陷工程	二维材料掺杂(p型、n型), 图案化缺陷引入
其他	[11]	应变工程	利用t-SPL纳米压痕调控二维材料物性

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Vol. 74, Issue 3 - 2025-02-05

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