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Compared with traditional communication technologies such as electrical interconnection, optical interconnection technology has the advantages of large bandwidth, low energy consumption, anti-interference, etc. Therefore, optical interconnection is becoming an important approach and development trend of short distance and very short distance data terminal communication. As the chip level optical interconnection is implemented, silicon on insulator (SOI) based on-chip optical interconnection has been widely utilized with the support of a series of multiplexing technologies. In recent decades, many on-chip optical interconnection devices have been developed by using conventional design methods such as coupled-mode, multimode interference, and transmission line theories. However, when used in device design, these conventional methods often face the problems such as complex theoretical calculations and high labor costs. Many of the designed devices also encounter the problems of insufficient compactness and integration, and single function. Intelligent design method has the advantages such as pellucid principle, high freedom of optimization, and good material compatibility, which can solve the problems of conventional design methods to a large extent. With the widespread use of intelligent design methods in the design of on-chip optical interconnection devices, three main trends have emerged. Firstly, the size of on-chip optical interconnect device is gradually developing towards ultra compact size. Secondly, the number of intelligently designed controllable on-chip optical interconnect devices is increasing. Thirdly, on-chip optical interconnect devices are gradually developing towards integration and systematization. This paper summarizes the most commonly used intelligent design methods of photonic devices, including intelligent algorithms based intelligent design methods and neural networks based intelligent design methods. Then, the above three important research advances and trends of intelligently designed on-chip optical interconnection devices are analyzed in detail. At the same time, the applications of phase change materials in the design of controllable photonic devices are also reviewed. Finally, the future development of intelligently designed on-chip optical interconnection devices is discussed. -
Keywords:
- on-chip optical interconnection device/
- intelligent design method/
- phase change material/
- integrated photonic circuit
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功率分束器类型 智能化设计结果
最大长度/μm传统设计结果
最大长度/μm波长不敏感单模 2 >25 双模 2.88/5.4 >200 任意分束比 1.5 >45 模式(分解)复用器类型 智能化设计结果
最大长度/μm传统设计结果
最大长度二阶 3 十微米量级 四阶/八阶(含偏振态) 6/4.8 百微米量级 弯曲波导类型 智能化设计结果
转弯半径/μm传统设计结果
转弯半径/μm三模 2.75 78.8 其他多模 <3.6(双模) 45(4种TM模式) -
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