- 必威体育下载

姓名
邮箱
手机号码
标题
留言内容
验证码

Abstract

In the era of highly thin, multi-functional and integrated electronic devices, it will inevitably lead to the heat accumulation inside the composite material, thereby seriously affecting the operation stability and service life of the equipment. How to realize the rapid and efficient heat conduction and heat dissipation of dielectric materials has become a bottleneck problem restricting the further development of electronic devices. The intrinsic thermal conductivity of traditional polyimide is low, which limits its application in electrical equipment, smart grid and other fields. The development of new high thermal conductivity polyimide dielectric film materials has become the focus of research. This paper introduces the thermal conduction mechanism of composite materials, summarizes the research progress and development status of thermally conductive polyimide films in recent years, and focuses on the effects of thermally conductive fillers, interface compatibility, and molding process of the thermal conductivity of materials. Finally, some key scientific and technical issues in the research are summarized and prospected in combination with the future development needs of thermally conductive polyimide composite dielectric materials.

Keywords:

Authors and contacts

Zha Jun-Wei^1,2,
Wang Fan¹

Corresponding author:Zha Jun-Wei,zhajw@ustb.edu.cn

Funds:Project supported by the National Natural Science Foundation of China (Grant No. 51977114).

FullText HTML: translate this paragraph

References

[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10]
[11]
[12]
[13]
[14]
[15]
[16]
[17]
[18]
[19]
[20]
[21]
[22]
[23]
[24]
[25]
[26]
[27]
[28]
[29]
[30]
[31]
[32]
[33]
[34]
[35]
[36]
[37]
[38]
[39]
[40]
[41]
[42]
[43]
[44]
[45]
[46]
[47]
[48]
[49]
[50]
[51]
[52]
[53]
[54]
[55]
[56]
[57]
[58]
[59]
[60]
[61]
[62]
[63]
[64]
[65]
[66]
[67]
[68]
[69]
[70]
[71]
[72]
[73]
[74]
[75]
[76]
[77]
[78]
[79]
[80]
[81]
[82]
[83]
[84]
[85]
[86]
[87]
[88]
[89]
[90]
[91]
[92]
[93]
[94]
[95]
[96]
[97]
[98]
[99]
[100]
[101]
[102]
[103]
[104]
[105]
[106]
[107]
[108]
[109]
[110]
[111]
[112]
[113]
[114]

Cited By

DownLoad: Full-Size Img PowerPoint

材料名称	热导率/(W·m^–1·K^–1)
环氧树脂 (EP)	0.20—0.88
聚氨酯 (PU)	0.25
聚偏氯乙烯 (PVDF)	0.19
聚二甲基硅氧烷 (PDMS)	0.19
聚苯乙烯 (PS)	0.18
低密度聚乙烯 (LDPE)	0.32—0.40
高密度聚乙烯 (HDPE)	0.38—0.51
聚丙烯 (PP)	0.17—0.22
聚醚醚酮 (PEEK)	0.25
聚氯乙烯 (PVC)	0.14—0.17
聚酰亚胺 (PI)	0.10—0.35
聚乙烯醇 (PVA)	0.20
聚四氟乙烯(PTFE)	0.25
聚甲醛 (POM)	0.40

DownLoad: CSV

[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10]
[11]
[12]
[13]
[14]
[15]
[16]
[17]
[18]
[19]
[20]
[21]
[22]
[23]
[24]
[25]
[26]
[27]
[28]
[29]
[30]
[31]
[32]
[33]
[34]
[35]
[36]
[37]
[38]
[39]
[40]
[41]
[42]
[43]
[44]
[45]
[46]
[47]
[48]
[49]
[50]
[51]
[52]
[53]
[54]
[55]
[56]
[57]
[58]
[59]
[60]
[61]
[62]
[63]
[64]
[65]
[66]
[67]
[68]
[69]
[70]
[71]
[72]
[73]
[74]
[75]
[76]
[77]
[78]
[79]
[80]
[81]
[82]
[83]
[84]
[85]
[86]
[87]
[88]
[89]
[90]
[91]
[92]
[93]
[94]
[95]
[96]
[97]
[98]
[99]
[100]
[101]
[102]
[103]
[104]
[105]
[106]
[107]
[108]
[109]
[110]
[111]
[112]
[113]
[114]

[1]	Liu Shu-Qian, Zhang Hai-Yan, Zhang Hui, Zhu Wen-Fa, Chen Yi-Ting, Liu Ya-Jie.Ultrasonic phase transfer imaging of wrinkled defects in composite materials fused with circular statistical vectors. Acta Physica Sinica, 2024, 73(17): 174301.doi:10.7498/aps.73.20240714
[2]	Zheng Jian-Jun, Zhang Li-Ping.Monolayer Cu₂X (X=S, Se): excellent thermoelectric material with low lattice thermal conductivity. Acta Physica Sinica, 2023, 0(0): 0-0.doi:10.7498/aps.72.20220015
[3]	Liu Xiu-Cheng, Yang Zhi, Guo Hao, Chen Ying, Luo Xiang-Long, Chen Jian-Yong.Molecular dynamics simulation of thermal conductivity of diamond/epoxy resin composites. Acta Physica Sinica, 2023, 72(16): 168102.doi:10.7498/aps.72.20222270
[4]	Liu Ying-Guang, Xue Xin-Qiang, Zhang Jing-Wen, Ren Guo-Liang.Thermal conductivity of materials based on interfacial atomic mixing. Acta Physica Sinica, 2022, 71(9): 093102.doi:10.7498/aps.71.20211451
[5]	An Meng, Sun Xu-Hui, Chen Dong-Sheng, Yang Nuo.Research progress of thermal transport in graphene-based thermal interfacial composite materials. Acta Physica Sinica, 2022, 71(16): 166501.doi:10.7498/aps.71.20220306
[6]	Yang Wen-Long, Han Jun-Sheng, Wang Yu, Lin Jia-Qi, He Guo-Qiang, Sun Hong-Guo.Molecular dynamics simulation on the glass transition temperature and mechanical properties of polyimide/functional graphene composites. Acta Physica Sinica, 2017, 66(22): 227101.doi:10.7498/aps.66.227101
[7]	Zhang Yuan, Gao Yan-Jun, Hu Cheng, Tan Xing-Yi, Qiu Da, Zhang Ting-Ting, Zhu Yong-Dan, Li Mei-Ya.Optimization design for magnetoelectric coupling property of the magnet/bimorph composite. Acta Physica Sinica, 2016, 65(16): 167501.doi:10.7498/aps.65.167501
[8]	Hou Kun, Zhang Zhan-Wen, Huang Yong, Wei Jian-Jun.Characterization and properties of polyimide films prepared in different monomer ratios by vapor deposited polymerization. Acta Physica Sinica, 2016, 65(3): 035203.doi:10.7498/aps.65.035203
[9]	Wang Song, Wu Zhan-Cheng, Tang Xiao-Jin, Sun Yong-Wei, Yi Zhong.Study on temperature and electric field dependence of conductivity in polyimide. Acta Physica Sinica, 2016, 65(2): 025201.doi:10.7498/aps.65.025201
[10]	Weng Ming, Hu Tian-Cun, Cao Meng, Xu Wei-Jun.Effects of electron incident angle on the secondary electron yield for polyimide. Acta Physica Sinica, 2015, 64(15): 157901.doi:10.7498/aps.64.157901
[11]	Lin Jia-Qi, Li Xiao-Kang, Yang Wen-Long, Sun Hong-Guo, Xie Zhi-Bin, Xiu Han-jiang, Lei Qing-Quan.Molecular dynamics simulation study on the structure and mechanical properties of polyimide/KTa0.5Nb0.5O3 nanoparticle composites. Acta Physica Sinica, 2015, 64(12): 126202.doi:10.7498/aps.64.126202
[12]	Yuan Si-Wei, Feng Yan-Hui, Wang Xin, Zhang Xin-Xin.Molecular dynamics simulation of thermal conductivity of mesoporous α-Al2O3. Acta Physica Sinica, 2014, 63(1): 014402.doi:10.7498/aps.63.014402
[13]	Zhang Cheng-Bin, Cheng Qi-Kun, Chen Yong-Ping.Molecular dynamics simulation on thermal conductivity of nanocomposites embedded with fractal structure. Acta Physica Sinica, 2014, 63(23): 236601.doi:10.7498/aps.63.236601
[14]	Yang Jin, Zhou Mao-Xiu, Xu Tai-Long, Dai Yue-Hua, Wang Jia-Yu, Luo Jing, Xu Hui-Fang, Jiang Xian-Wei, Chen Jun-Ning.Composite interfaces and electrode properties of resistive random access memory devices. Acta Physica Sinica, 2013, 62(24): 248501.doi:10.7498/aps.62.248501
[15]	Sun Wei-Feng, Wang Xuan.Molecular dynamics simulation study of polyimide/copper-nanoparticle composites. Acta Physica Sinica, 2013, 62(18): 186202.doi:10.7498/aps.62.186202
[16]	Li Zhen-Wu.Opto-electronic properties of CdS nano particle/carbon nanotube composites. Acta Physica Sinica, 2012, 61(1): 016103.doi:10.7498/aps.61.016103
[17]	Huo Yan, Zhang Cun-Lin.Quantitative infrared prediction method for defect depth in carbon fiber reinforced plastics composite. Acta Physica Sinica, 2012, 61(14): 144204.doi:10.7498/aps.61.144204
[18]	Huang Cong-Liang, Feng Yan-Hui, Zhang Xin-Xin, Li Wei, Yang Mu, Li Jing, Wang Ge.Thermal conductivity measurements on PANI/SBA-15 and PPy/SBA-15. Acta Physica Sinica, 2012, 61(15): 154402.doi:10.7498/aps.61.154402
[19]	Fan Yong, Bu Wen-Bin, Liu Xiao-Xu, Cheng Wei-Dong, Wu Zhong-Hua, Yin Jing-Hua.Research on interface and fractal characteristics of PI/Al2O3Films by SAXS. Acta Physica Sinica, 2011, 60(5): 056101.doi:10.7498/aps.60.056101
[20]	Wang Jian-Li, Xiong Guo-Ping, Gu Ming, Zhang Xing, Liang Ji.A study on the thermal conductivity of multiwalled carbon nanotube/polypropylene composite. Acta Physica Sinica, 2009, 58(7): 4536-4541.doi:10.7498/aps.58.4536

Catalog

Vol. 71, Issue 23 - 2022-12-05

Metrics

Abstract views:6386
PDF Downloads:272
Cited By:0

Search

Article