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Yang Yuan, Hu Nai-Fang, Jin Yong-Cheng, Ma Jun, Cui Guang-Lei.Research advance of lithium-rich cathode materials in all-solid-state lithium batteries. Acta Physica Sinica, 2023, 72(11): 118801.doi:10.7498/aps.72.20230258 |
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Wang Li-Na, Chen Li, Sheng Min-Jia, Wang Lei-Lei, Cui Hai-Hang, Zheng Xu, Huang Ming-Hua.Interface evolution mechanism of dual-bubble coalescence driving micromotors in bulk phase. Acta Physica Sinica, 2023, 72(16): 164703.doi:10.7498/aps.72.20230608 |
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Li Chang, Hou Zhao-Yang, Niu Yuan, Gao Quan-Hua, Wang Zhen, Wang Jin-Guo, Zou Peng-Fei.Simulation of nucleation and evolution process of nuclei during solidification of Ti3Al alloy. Acta Physica Sinica, 2022, 71(1): 016101.doi:10.7498/aps.71.20211415 |
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Wang Hai-Yan, Hu Qian-Ku, Yang Wen-Peng, Li Xu-Sheng.Influence of metal element doping on the mechanical properties of TiAl alloy. Acta Physica Sinica, 2016, 65(7): 077101.doi:10.7498/aps.65.077101 |
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Zhang Hong, Niu Dong-Mei, Lü Lu, Xie Hai-Peng, Zhang Yu-He, Liu Peng, Huang Han, Gao Yong-Li.Thickness-dependent electronic structure of the interface of 2,7-dioctyl[1]benzothieno[3,2-b][1] benzothiophene/Ni(100). Acta Physica Sinica, 2016, 65(4): 047902.doi:10.7498/aps.65.047902 |
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Qian Ze-Yu, Zhang Lin.Atomical simulations of structural changes of a melted TiAl alloy particle on TiAl (001) substrate. Acta Physica Sinica, 2015, 64(24): 243103.doi:10.7498/aps.64.243103 |
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Zhao Ning, Zhong Yi, Huang Ming-Liang, Ma Hai-Tao, Liu Xiao-Ping.Effect of thermomigration on the growth kinetics of Cu6Sn5 at liquid-solid interfaces in Cu/Sn/Cu solder joints. Acta Physica Sinica, 2015, 64(16): 166601.doi:10.7498/aps.64.166601 |
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Zhou Hua-Guang, Lin Xin, Wang Meng, Huang Wei-Dong.Calculation of crystal-melt interfacial free energy of Cu by molecular dynamics simulation. Acta Physica Sinica, 2013, 62(5): 056803.doi:10.7498/aps.62.056803 |
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Liu Lei, Chen Zheng, Wang Yong-Xing.The simulation of precipitate splitting in alloy (Ⅰ): segmentation mechanism. Acta Physica Sinica, 2012, 61(18): 186401.doi:10.7498/aps.61.186401 |
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Huang Ming-Liang, Chen Lei-Da, Zhou Shao-Ming, Zhao Ning.Effect of electromigration on interfacial reaction in Ni/Sn3.0Ag0.5Cu/Au/Pd/Ni-P flip chip solder joints. Acta Physica Sinica, 2012, 61(19): 198104.doi:10.7498/aps.61.198104 |
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Song Cheng-Fen, Fan Qin-Na, Li Wei, Liu Yong-Li, Zhang Lin.Atomic-scale study of structural change of TiAl alloy film during the cooling process. Acta Physica Sinica, 2011, 60(6): 063104.doi:10.7498/aps.60.063104 |
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Hu Xing, Wang Wei, Mao Xiang-Yu, Chen Xiao-Bing.Magnetic and electric properties of Co-doped Bi5Ti3FeO15 multiferroic ceramics. Acta Physica Sinica, 2010, 59(11): 8160-8166.doi:10.7498/aps.59.8160 |
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Zhao Da-Wen, Li Jin-Fu.Phase-field modeling of the effect of liquid-solid interface anisotropies on free dendritic growth. Acta Physica Sinica, 2009, 58(10): 7094-7100.doi:10.7498/aps.58.7094 |
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Wang Kuang-Fei, Li Bang-Sheng, Ren Ming-Xing, Mi Guo-Fa, Guo Jing-Jie, Fu Heng-Zhi.Numerical simulation of columnar to equiaxial transition during solidification of Ti-44at%Al alloy. Acta Physica Sinica, 2007, 56(6): 3337-3343.doi:10.7498/aps.56.3337 |
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Cao Bo, Bao Liang-Man, Li Gong-Ping, He Shan-Hu.Diffusion and interface reaction of Cu and Si in Cu/SiO2/Si (111) systems. Acta Physica Sinica, 2006, 55(12): 6550-6555.doi:10.7498/aps.55.6550 |
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Zhang Jian-Min, Xin Hong, Wei Xiu-Mei.Interface-energy calculation for Ag/Ni twist boundaries with MAEAM. Acta Physica Sinica, 2005, 54(1): 237-241.doi:10.7498/aps.54.237 |
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