A metal mesh transparent conductive film with high shielding performance is prepared based on the crack template method. The shielding performance of the metal mesh transparent conductive film prepared by the existing crack template method needs improving due to the thin thickness of the metal mesh. In this work, the crack depth factor is added to the distribution curve of the relationship between the spin coating speed of the cracked material and the crack pattern, and the appropriate crack material and spin coating scheme are selected to prepare an ideal crack template with random pattern distribution. A metal layer with a thickness of 1 μm is deposited inside and outside the crack template gap by magnetron sputtering, and the method of ultrasonic cleaning combined with organic solvent is introduced to efficiently remove the crack glue template, and a metal mesh transparent conductive film sample is obtained. The measured light transmittance of the metal mesh transparent conductive film sample exceeds 85% while the square resistance value remains around 2.8 Ω/□, which has good light transmittance and electromagnetic shielding performance. The shielding performance is improved by preparing thickened metal mesh transparent conductive films, which provide a reference for the subsequent preparation of metal mesh transparent conductive films with high shielding performance based on the crack template method.