- 必威体育下载

姓名
邮箱
手机号码
标题
留言内容
验证码

Abstract

Developing thermally conductive polymers is of fundamental interest and technological importance. Common polymers have low thermal conductivities on the order of 0.1 W·m ^–1·K ^–1and thus are regarded as thermal insulators. Compared with the traditional heat conductors (metals and ceramics), polymers have unparalleled combined properties such as light weight, corrosion resistance, electrical insulation and low cost. Turning polymer insulators into heat conductors will provide new opportunities for future thermal management applications. Polymers may replace many metals and ceramics, serving as lightweight heat dissipators in electronics, refrigerators, and electrical vehicles. In this review and perspectives, we discuss the research progress of thermal transport mechanisms in polymers and reveal the relations between thermal conductivity and polymer structural parameters such as bond strength, crystallinity, crystallite size, chain orientation, radius of gyration, and molecular weight. We discuss the advanced strategies for developing thermally conductive polymers by both bottom-up and top-down approaches. We highlight how thermally conductive polymers provide new opportunities for thermal management applications. Finally, we emphasize the future challenges to and opportunities for designing and synthesizing polymers with metal-like thermal conductivity and exploring the thermal transport physics in polymers. We believe that the thermally conductive polymers with their unparalleled combination of characteristics (light weight, electrical insulation, easy processability, corrosion resistance, etc.) promise to possess many existing and unforeseen thermal management applications.

Keywords:

Authors and contacts

Liu Yu-Rui¹,
Xu Yan-Fei^1,2

Corresponding author:Xu Yan-Fei,yanfeixu@umass.edu

Funds:Project supported by the Faculty Startup Fund Support from University of Massachusetts Amherst, USA

FullText HTML: translate this paragraph

References

[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10]
[11]
[12]
[13]
[14]
[15]
[16]
[17]
[18]
[19]
[20]
[21]
[22]
[23]
[24]
[25]
[26]
[27]
[28]
[29]
[30]
[31]
[32]
[33]
[34]
[35]
[36]
[37]
[38]
[39]
[40]
[41]
[42]
[43]
[44]
[45]
[46]
[47]
[48]
[49]
[50]
[51]
[52]
[53]
[54]
[55]
[56]
[57]
[58]
[59]
[60]
[61]
[62]
[63]
[64]
[65]
[66]
[67]
[68]
[69]
[70]
[71]
[72]
[73]
[74]
[75]
[76]
[77]
[78]
[79]
[80]
[81]
[82]
[83]
[84]
[85]
[86]
[87]
[88]
[89]
[90]
[91]
[92]
[93]
[94]
[95]
[96]
[97]
[98]
[99]
[100]
[101]
[102]
[103]
[104]
[105]
[106]
[107]
[108]
[109]
[110]

Cited By

DownLoad: Full-Size Img PowerPoint

DownLoad: Full-Size Img PowerPoint

[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10]
[11]
[12]
[13]
[14]
[15]
[16]
[17]
[18]
[19]
[20]
[21]
[22]
[23]
[24]
[25]
[26]
[27]
[28]
[29]
[30]
[31]
[32]
[33]
[34]
[35]
[36]
[37]
[38]
[39]
[40]
[41]
[42]
[43]
[44]
[45]
[46]
[47]
[48]
[49]
[50]
[51]
[52]
[53]
[54]
[55]
[56]
[57]
[58]
[59]
[60]
[61]
[62]
[63]
[64]
[65]
[66]
[67]
[68]
[69]
[70]
[71]
[72]
[73]
[74]
[75]
[76]
[77]
[78]
[79]
[80]
[81]
[82]
[83]
[84]
[85]
[86]
[87]
[88]
[89]
[90]
[91]
[92]
[93]
[94]
[95]
[96]
[97]
[98]
[99]
[100]
[101]
[102]
[103]
[104]
[105]
[106]
[107]
[108]
[109]
[110]

[1]	Wang Ao, Sheng Yu-Fei, Bao Hua.Recent advances in thermal transport theory of metals. Acta Physica Sinica, 2024, 73(3): 037201.doi:10.7498/aps.73.20231151
[2]	Xu Hao-Zhe, Xu Xiang-Fan.Thermal percolation network in Al₂O₃based thermal conductive polymer. Acta Physica Sinica, 2023, 72(2): 024401.doi:10.7498/aps.72.20221400
[3]	Liu Xiu-Cheng, Yang Zhi, Guo Hao, Chen Ying, Luo Xiang-Long, Chen Jian-Yong.Molecular dynamics simulation of thermal conductivity of diamond/epoxy resin composites. Acta Physica Sinica, 2023, 72(16): 168102.doi:10.7498/aps.72.20222270
[4]	An Meng, Sun Xu-Hui, Chen Dong-Sheng, Yang Nuo.Research progress of thermal transport in graphene-based thermal interfacial composite materials. Acta Physica Sinica, 2022, 71(16): 166501.doi:10.7498/aps.71.20220306
[5]	Zha Jun-Wei, Wang Fan.Research progress of high thermal conductivity polyimide dielectric films. Acta Physica Sinica, 2022, 71(23): 233601.doi:10.7498/aps.71.20221398
[6]	Liu Ying-Guang, Xue Xin-Qiang, Zhang Jing-Wen, Ren Guo-Liang.Thermal conductivity of materials based on interfacial atomic mixing. Acta Physica Sinica, 2022, 71(9): 093102.doi:10.7498/aps.71.20211451
[7]	Zheng Cui-Hong, Yang Jian, Xie Guo-Feng, Zhou Wu-Xing, Ouyang Tao.Effect of ion irradiation on thermal conductivity of phosphorene and underlying mechanism. Acta Physica Sinica, 2022, 71(5): 056101.doi:10.7498/aps.71.20211857
[8]	Liu Ying-Guang, Ren Guo-Liang, Hao Jiang-Shuai, Zhang Jing-Wen, Xue Xin-Qiang.Thermal conductivity of Si/Ge superlattices containing tilted interface. Acta Physica Sinica, 2021, 70(11): 113101.doi:10.7498/aps.70.20201807
[9]	Liu Ying-Guang, Hao Jiang-Shuai, Ren Guo-Liang, Zhang Jing-Wen.Thermal conductivities of different period Si/Ge superlattices. Acta Physica Sinica, 2021, 70(7): 073101.doi:10.7498/aps.70.20201789
[10]	.Effect of ion irradiation on thermal conductivity of phosphorene and underlying mechanism. Acta Physica Sinica, 2021, (): .doi:10.7498/aps.70.20211857
[11]	Xu Wen-Xue, Liang Xin-Gang, Xu Xiang-Hua, Zhu Yuan.Molecular dynamics simulation of effect of crosslinking on thermal conductivity of silicone rubber. Acta Physica Sinica, 2020, 69(19): 196601.doi:10.7498/aps.69.20200737
[12]	Lan Sheng, Li Kun, Gao Xin-Yun.Based on the molecular dynamics characteristic research of heat conduction of graphyne nanoribbons with vacancy defects. Acta Physica Sinica, 2017, 66(13): 136801.doi:10.7498/aps.66.136801
[13]	Yuan Si-Wei, Feng Yan-Hui, Wang Xin, Zhang Xin-Xin.Molecular dynamics simulation of thermal conductivity of mesoporous α-Al2O3. Acta Physica Sinica, 2014, 63(1): 014402.doi:10.7498/aps.63.014402
[14]	Zhang Cheng-Bin, Cheng Qi-Kun, Chen Yong-Ping.Molecular dynamics simulation on thermal conductivity of nanocomposites embedded with fractal structure. Acta Physica Sinica, 2014, 63(23): 236601.doi:10.7498/aps.63.236601
[15]	Hui Zhi-Xin, He Peng-Fei, Dai Ying, Wu Ai-Hui.Molecular dynamics simulation of the thermal conductivity of silicon functionalized graphene. Acta Physica Sinica, 2014, 63(7): 074401.doi:10.7498/aps.63.074401
[16]	Zheng Bo-Yu, Dong Hui-Long, Chen Fei-Fan.Characterization of thermal conductivity for GNR based on nonequilibrium molecular dynamics simulation combined with quantum correction. Acta Physica Sinica, 2014, 63(7): 076501.doi:10.7498/aps.63.076501
[17]	Li Wei, Feng Yan-Hui, Tang Jin-Jin, Zhang Xin-Xin.Thermal conductivity and thermal rectification of carbon nanotube Y junctions. Acta Physica Sinica, 2013, 62(7): 076107.doi:10.7498/aps.62.076107
[18]	Yang Ping, Wang Xiao-Liang, Li Pei, Wang Huang, Zhang Li-Qiang, Xie Fang-Wei.The effect of doped nitrogen and vacancy on thermal conductivity of graphenenanoribbon from nonequilibrium molecular dynamics. Acta Physica Sinica, 2012, 61(7): 076501.doi:10.7498/aps.61.076501
[19]	Yang Ping, Wu Yong-Sheng, Xu Hai-Feng, Xu Xian-Xin, Zhang Li-Qiang, Li Pei.Molecular dynamics simulation of thermal conductivity for the TiO2/ZnO nano-film interface. Acta Physica Sinica, 2011, 60(6): 066601.doi:10.7498/aps.60.066601
[20]	Wu Guo-Qiang, Kong Xian-Ren, Sun Zhao-Wei, Wang Ya-Hui.Molecular dynamics simulation on the out-of plane thermal conductivity of argon crystal thin films. Acta Physica Sinica, 2006, 55(1): 1-5.doi:10.7498/aps.55.1

Catalog

Vol. 71, Issue 2 - 2022-01-20

Metrics

Abstract views:9628
PDF Downloads:417
Cited By:0

Search

Article