As a novel development of semiconductor process, direct metallic patterning has the advantages of simple steps, low cost, etc. However, almost all transfer media are Newtonian fluids in traditional nanoimprint lithography. Newtonian fluid viscosity is constant. Too high a viscosity is adverse to filling the small space, and if viscosity is too low, it is harmful to solidify graphics. So an appropriate viscosity range that can both realize a high filling degree and benefit solidification is difficult to determine. Pseudoplastic fluid viscosity decreases with the increase of shear rate. The problem would be solved well when pseudoplastic fluid is used as a transfer medium. Synthesizing the advantages of direct metallic patterning and pseudoplastic fluid feature, a novel idea is put forward. The pseudoplastic metal nanofluids, which would be fabricated with metal nanoprticals, can take the place of transfer medium in nanoimprint lithography. Based on the finite element method, COMSOL software is used to compute the filling degree of pseudoplastic fluid, and the results are compared with those of Newtonian fluid under the same conditions. Factors, such as viscosity, imprinting speed, pressure, etc., which would affect filling degree, can be obtained from simulation results. These parameters provide a theoretical basis for designing technological process and fabricating pseudoplastic fluids in future work.